We pulled into the parking lot a little before 5:00 pm. The volunteers were already gathered and had made two long lines of empty boxes. Our two trucks were filled with the food that Free the Need volunteers had collected throughout the week; food that would have otherwise ended up in landfill. The food is brought to this local Klamath River center to be distributed to families in need.
The volunteers worked together like a well-oiled machine. Vegetables, fruit, canned foods, bread, cheese, and milk, along with flowers, were put into the boxes. After checking them to make sure the food looked evenly distributed, everyone lined up to receive boxes for their families and neighbors. The whole operation was joyful, friendly and took less than an hour.
In addition to Klamath River, Free the Need delivers food to families in San Francisco. The organization is all volunteer, so any cash donations received go 100% to food distribution. Free the Need believes in an abundant universe. Its volunteers are breaking the chain of poverty by distributing surplus food that would otherwise go to waste. If a family is freed of the need for food, they can put more energy into creating a better life. Free the Need believes that there is enough of what people need to go around, and that once people feel filled up, they have enough surplus to give to others.
I also believe in an abundant universe, and am honored to be a member of Free the Need’s board of directors. I attended a planning meeting for 2018, and was impressed by the care with which plans and procedures for the new year were discussed. Free the Need is launching a fund-drive to raise money to purchase an additional truck needed for food transportation. They are also looking into a storage facility in San Francisco to support their growing work. For more information, or if you would like to volunteer or make a gift of support, please visit their website at www.freetheneed.org/.
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In the process of designing and making PCB, have you ever encountered the bad situation of PCB tin eating? For engineers, once a PCB board has a tin problem, it often means that it needs to be re-welded or even re-fabricated. The consequences are very headache. So, what are the causes of poor tin consumption in PCB? How can we avoid this problem? First, what is PCB tin? The colloquial expression about solder adhesion in soldering of electronic components and circuits and circuit boards. Tin coating means ironing a mass of tin on the solder joint. Tin feeding means that soldering materials and tin form a solid seamless welding interface. 2. Why does PCB eat tin? Poor tin consumption is due to the fact that some parts of the surface of the circuit are not stained with tin. The reason is that there are oil and impurities on the surface, which can be washed by solvent. The usage conditions of flux are not adjusted properly, such as the air pressure and height required for foaming. The specific gravity is also one of the important factors, because the distribution of flux on the line surface is affected by the specific gravity. The possibility of improper flux usage due to incorrect labeling and poor storage conditions can also be ruled out by checking the specific gravity. Insufficient soldering time or temperature. Generally, the operating temperature of soldering tin is 55-80 C higher than its melting point temperature. 3. Analytical Method of PCB Sn Eating 1. Observe whether the components are black, discolored and oxidized, and the cleanliness of the components also affects the fullness of tin. 2. Observe whether the PCB surface is adhering to grease, impurities and other solvents. There is also to see whether there are polished particles left on the PCB surface. PCB storage time is too long to live storage time, inappropriate environment of the substrate surface or parts tin surface will oxidize, this phenomenon can only be helpful to the tin effect once again, but also quite labor-intensive. 3. The improper use of flux, such as the pressure and height required for foaming, is also one of the most important factors. The improper storage environment or improper use of flux may also lead to poor tin eating. 4. There is also a proper preheating temperature. If the preheating temperature does not reach the required temperature, the solder can not be fully melted, or there are too many impurities in the solder, which may lead to poor tin eating. IV. Processing of PCB Sn Eating 1. unsuitable terminal material for parts. Check parts to make terminals clean and well dipped. Silicone oil, general release agent and lubricant contain this kind of oil, it is not easy to be completely cleaned. Therefore, silicone oil should be avoided as far as possible in the manufacturing process of electronic parts. The oxidation preventive oils used in soldering furnaces should also be noted that they are not of this type. 2. Preheating temperature is not enough. The preheating temperature can be adjusted so that the temperature of the side surface of the substrate parts can reach the required temperature of about 90 ~110. 3. There are too many impurities in solder, which do not meet the requirements. The impurities in solder can be measured on time. If the impurities exceed the standard, the standard solder can be replaced. 4. Maintaining the smooth transmission of the substrate after soldering and sufficient cooling and moving of the substrate to be soldered can avoid this problem. The solution is to have another tin wave.http://www.pcbindex.com